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Silver dipping process of MLCC
2017-07-20 05:52  Visit:58
Price:Unfilled
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Model Number: GTG535 Key Specifications/Special Features: Silver dipping process of MLCCSplicing for release paperPlate masking on PCBFor powder coating process on PCBPet film: 50Total thickness: 85Adhesion(kg/25mm): over 0.7
  • Unwinding force (g/25mm): under 650
  • Temp: 180°C
    • Shipping Information:
    • FOB Port: Taiwan
    Main Export Markets:
    • Mid East/Africa
    • North America
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    Contact information
    Company:Solar Plus Company
    Status:Offline Send a letter
    Name:solarplus(Ms.)
    Tel: (886 3) 3272089 (886) 932921890
    Fax: (886 3) 3272067
    Area:Beijing
    Address:1F., no.480, Sec., 6, Yanping N.Rd.,Shihlin District, Taipei city,, Taipei, Taiwan (11175)
    Zip code:000000
    Mail:solarplus@qq.com
    Linkurl:http://solarplus.masxlyjjx.com/
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